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I-Electronic Packaging Material

I-Electronic Packaging Material

  • I-Tungsten Copper WCu Heat Sink

    I-Tungsten Copper WCu Heat Sink

    Izinto zethusi ze-Tungsten zingakha ukufana okuhle kokunwetshwa okushisayo ngezinto ze-ceramic, izinto ze-semiconductor, izinto zensimbi, njll., futhi zisetshenziswa kabanzi ku-microwave, imvamisa yomsakazo, i-semiconductor high-power packaging, i-semiconductor lasers kanye nokuxhumana optical neminye imikhakha.

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  • I-CMC CuMoCu Heat Sink

    I-CMC CuMoCu Heat Sink

    I-Cu/Mo/Cu(CMC) isinki yokushisa, eyaziwa nangokuthi i-CMC alloy, iyisemishi elakhiwe kanye ne-flat-panel composite material.Isebenzisa i-molybdenum emsulwa njengento ewumgogodla, futhi imbozwe ngethusi elimsulwa noma ukuhlakazwa kwethusi eliqinisiwe nhlangothi zombili.

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Chofoza u-enter ukuze useshe noma u-ESC ukuze uvale